microtech GmbH electronicCDP - thick film series - Power variant

Produktspezifikationen

• All sizes can be manufactured with the following contact variants: Electroplated pure tin, Contact with low rest permeability -N, suitable only for reflow soldering method,Epoxy bondable contact -K
• Chip resistors in thick film technology
• high stability and reliability
• Resistance area coated with glass and varnish passivation
• Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
• Tight tolerances (=0,5%) – low temperature coefficient