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Übersicht über unser Produktportfolio Produktkategorien Induktivitäten | inductors in der Kategorie Inductors

AEM Components, Inc.

Multilayer Ceramic Inductors MHI

  • Superior termination bonding strength
  • Standard EIA/EIAJ chip sizes such as 0402/1005 and 0603/1608
  • Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
  • Monolithic structure with high reliability
  • High quality ceramic material and unique manufacturing processes providing high Q at high frequencies and high self-resonant frequencies

NIC Components Corp.

NLA Series Wound Air Core Inductors

  • mold flat top for automatic pick & place
  • High Q Over Wide Frequency Range
  • Chip Inductors
  • available in 0403, 0504, 0703 and 1006 case sizes
  • air core chip inductors

NIC Components Corp.

NPI_LS Series Unshielded Power Inductors

  • taped and reeled for automatic insertion
  • takes up less PCB real estate and saves more power
  • surface mountable construction
  • surface mount technology
  • small size with current ratings to 16.5 Amps
  • non-shielded magnetic circuit design
  • min. DCR 0,008R
  • max. rise current 6,3A
  • Inductance range is 0.68µH to 330µH

NIC Components Corp.

NTI Series Thin Film Chip Inductors

  • ultra-small low profile 0201, 0402 & 0603 sizes
  • Thin Film; High Precision
  • high current & high SRF
  • compatible with Pb-Free Soldering
  • Chip Inductors

NIC Components Corp.

NFH Surface Mount Multilayer Inductor

  • package for automatic pick-place
  • high DC current and Low DC resistance
  • 0603 to 0805 case sizes

NIC Components Corp.

NFI Series Ferrite Chip Inductor

  • tape & reel packaging for automatic insertion
  • surface mount 0603 ~ 1206 case sizes
  • Pb-FREE/RoHS compliant
  • magnetically shielded
  • Durable Multilayer Construction
  • both flow and reflow solderable

NIC Components Corp.

NFP Series Surface Mount Multilayer Inductor

  • reflow soldering applicable
  • package for automatic pick-place
  • Multilayer Ferrite Chip Power Inductors
  • high DC current and Low DC resistance
  • 0805, 0806 and 1008 case size

NIC Components Corp.

NIN Series Molded Chip Wirewound Inductors

  • Suitable for Flow and Refl ow Soldering Processes
  • high inductance available small size
  • excellent high Q and high SRF characteristics
  • embossed plastic tape packaging for automatic pick-place
  • Chip Inductors

NIC Components Corp.

NIN-H Series Wirewound Chip Inductors

  • wirewound
  • SIZES K(0402), J (0603), D (0805), C (1008), E (1206), A (1210) and B (1812)
  • open Frame
  • high Q, high current and high SRF characteristics
  • high inductance available small size
  • embossed plastic carrier packaging for automatic pick-place
  • Chip Inductors

NIC Components Corp.

NIS Series 0402/0603 Chip Inductors

  • tight tolerances (D ± 0.3nH, G ± 2% or J ± 5%)
  • super miniature EIA 0402 & 0603 size in resin enclosed body
  • Laser Cut; Alumina Core
  • laser cut spiral coil alumina core
  • Chip Inductors

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